Assembly & Packaging

The HSG-IMIT’s offered services for the assembly and packaging of MEMS include:

  • Electric contacting
  • Adhesive technology
  • Housing
  • Mounting and contacting techniques for system integration
  • Laser soldering
  • Customer-specific solutions

All this know-how is used for customer-specific development of micromechanical applications. It is also available for assembly & packaging services for external customers.

 

Your Contact:
Dipl.-Ing. Roland Gronmaier
Telephone: +49 7721 / 943 - 239
Fax: +49 7721 / 943 - 210
Email: roland.gronmaier@hsg-imit.de

Your Contact:
Dr. Mani Alavi
Telephone: +49 7721 / 943 - 133
Fax: +49 7721 / 943 - 210
Email: mani.alavi@hsg-imit.de

Thermal inclination sensor
Laser soldering station